The conferences ( 2019 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering ( SMILE 2019 ) 2019 International Symposium on Semiconductor Manufacturing Intelligence ( ISMI2019 )) are sponsored by IEEE Beijing Section, co-sponsored by Department of Industrial Engineering & Engineering Management, National Tsing Hua University, Department of Industrial Engineering, Tianjin University and organized by Zhejiang University. The conferences are to be held during April 19th-21th, 2019. The conferences will provide a high-level international forum for experts, scholars and entrepreneurs to foster the exchange of research developments and latest practice on smart manufacturing, industrial engineering and logistics. With the main trend of Industry 4.0, the conferences will focus on the recent theoretical and methodological developments, significant technical applications, case studies and survey results in the areas of manufacturing informatics, manufacturing intelligence, Big data analytics & data mining, modeling and decision analysis, Internet of Things, green supply chains and intelligent logistics. SMILE 2019 will serve to establish collaborations among academics and industries to find global partners to promote the development of smart manufacturing, industrial engineering and logistics.
Special session proposal submission deadline
Full paper Submission Deadline
Notification of Paper Acceptance
Camera-Ready Copy Due
Opening Ceremony and Keynote Speech
Keynote Speech and Session
on or before December 1, 2018
on or before December 31, 2018
on or before January 31, 2019
on or before February 20, 2019
on April 20, 2019
on April 21, 2019
The full papers accepted by SMILE 2019 & ISMI 2019 will be published in an IEEE conference proceeding. Selected papers will be recommended for submission and possible publications in SCI special issue or journals after rigorous review.